- Mfr. #:
- THGBMHG6C1LBAIL
- Description:
- eMMC 8GB 15nm eMMC (EEPROM)
- Lifecycle:
- New from this manufacturer.
- Delivery
- DHL / FedEx / Ups / TNT / EMS
- Payment
- T/T / Paypal / Visa / MoneyGram / Western / Union
THGBMHG6C1LBAIL Information
- THGBM e-MMC™ NAND Flash Memory
- Toshiba THGBM e-MMC™ product family features advanced, highly-efficient NAND flash memory devices with an integrated controller, enhanced memory management, and 4GB to 128GB densities. The integrated memory management features include error correction, wear-leveling, and bad-block management. THGBM products are 2D NAND, while the THGAM products are 3D NAND.
Specifications
| Product Type: | eMMC |
|---|---|
| Product Category: | eMMC |
| Moisture Sensitive: | Yes |
| RoHS: | Y |
| Packaging: | Tray |
| Brand: | Toshiba Memory |
| Manufacturer: | Toshiba |
| Product: | NAND Flash |
| Subcategory: | Memory & Data Storage |
| Memory Size: | 8 GB |
| Factory Pack Quantity: | 152 |
| Minimum Operating Temperature: | - 25 C |
| Maximum Operating Temperature: | + 85 C |
THGBMHG6C1LBAIL Price & Stock
Toshiba THGBMHG6C1LBAIL pricing and available inventory.
| Seller | SKU | Stock | 1 | 10 | 100 | 1000 | 10000 | Updated |
|---|---|---|---|---|---|---|---|---|
| OMO Electronics | 523855 | 32,725 | - | - | 24.97 | 24.97 | 24.97 | 2019-12-25T10:39:40Z |
| LCSC | C391257 | 128 | 37.65 | 32.24 | 30.26 | 29.27 | 29.27 | 2019-11-19T23:40:06Z |
| iodParts | THGBMHG6C1LBAIL | 3,648 | - | - | - | - | - | 2019-12-13T04:41:05Z |
| Hermes Engineering | THGBMHG6C1LBAIL | 25 | - | - | - | - | - | 2019-12-02T08:53:07Z |
| Sourceability | THGBMHG6C1LBAIL | 20,520 | - | - | - | - | - | 2019-12-18T20:43:39Z |
| LTL Group | 6174277 | 1,535 | - | - | - | - | - | 2019-12-23T01:29:13Z |
| Chip Components | THGBMHG6C1LBAIL | 15,320 | - | - | - | - | - | 2019-12-23T02:38:24Z |
| Bison Technologies | THGBMHG6C1LBAIL-304232-TOSHIBA | 10,000 | - | - | - | - | - | 2019-11-21T13:36:41Z |
| GreenTree Electronics | THGBMHG6C1LBAIL | 20,000 | - | - | - | - | - | 2019-11-06T14:43:13Z |
| Chip 1 Exchange | THGBMHG6C1LBAIL | 450 | - | - | - | - | - | 2019-11-19T09:43:30Z |
| Abacus Technologies | THGBMHG6C1LBAIL | 15,446 | - | - | - | - | - | 2019-12-06T00:07:36Z |
| Sierra IC | THGBMHG6C1LBAIL | Contact | - | - | - | - | - | 2019-12-16T00:48:56Z |
AD5242BRUZ1M distributor
- Ball grid array - WikipediaTHGBMHG6C1LBAIL - All Products
- THGBMHG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA ball BGA FBGA: fine ball grid array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs; also known as fine pitch ball grid array (JEDEC-Standard) or. fine line BGA by Altera. https://en.wikipedia.org › wiki › Ball_grid_array Ball grid array - Wikipedia package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG6C1LBAIL has an industry standard MMC protocol for easy use.
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Alternate Names
Toshiba has several brands around the world that may have alternate names for THGBMHG6C1LBAIL due to regional differences or acquisition. THGBMHG6C1LBAIL may also be known as the following names:
- TOSH THGBMHG6C1LBAIL
- TOS THGBMHG6C1LBAIL
- SMK THGBMHG6C1LBAIL
- TOSHIB THGBMHG6C1LBAIL
- TOSHI THGBMHG6C1LBAIL
- TSENG THGBMHG6C1LBAIL
- TOSHIBA CORP THGBMHG6C1LBAIL
- TSH THGBMHG6C1LBAIL
- Toshiba Semiconductor and Storage THGBMHG6C1LBAIL
- MARKTECH OPTOELECTRONICS THGBMHG6C1LBAIL
- TOSHIBA CORPORATION THGBMHG6C1LBAIL
- TOSHIBA ELECTRONIC COMPONENTS THGBMHG6C1LBAIL
- TOSHIBAPb THGBMHG6C1LBAIL
- TOSHIBA-PB FREE THGBMHG6C1LBAIL
- TOSHIBA AMERICA THGBMHG6C1LBAIL
- TOSHIBA ELECTRONICS THGBMHG6C1LBAIL
- TOBHIBA THGBMHG6C1LBAIL
- TOSHIBA SEMI THGBMHG6C1LBAIL
- TOSHIAB THGBMHG6C1LBAIL
- TSHBA THGBMHG6C1LBAIL
- Toshiba America Electronic Components Inc THGBMHG6C1LBAIL
- TOSHIBA ELECTRONICS ASIA LTD THGBMHG6C1LBAIL
- TOSHIBAMC THGBMHG6C1LBAIL
- Toshiba America Electronic Components THGBMHG6C1LBAIL
- TOSHIBAL THGBMHG6C1LBAIL